Invention Grant
- Patent Title: Electronic device with heat dissipation structure
- Patent Title (中): 具有散热结构的电子设备
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Application No.: US13191466Application Date: 2011-07-27
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Publication No.: US08508942B2Publication Date: 2013-08-13
- Inventor: Bo Tian , Kang Wu
- Applicant: Bo Tian , Kang Wu
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN20111036202 20110525
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
An electronic device includes an enclosure. The enclosure includes a motherboard area and a power supply area adjacent to the motherboard area, which are both located at a first end of the enclosure, a hard disk drive area for mounting hard disk drives at a second end of the enclosure, and a fan area arranged between the motherboard area and the hard disk drive area.
Public/Granted literature
- US20120300399A1 ELECTRONIC DEVICE WITH HEAT DISSIPATION STRUCTURE Public/Granted day:2012-11-29
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