Invention Grant
- Patent Title: Bottom hole assembly
- Patent Title (中): 底孔装配
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Application No.: US12908192Application Date: 2010-10-20
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Publication No.: US08511383B2Publication Date: 2013-08-20
- Inventor: Tommy Stewart , Michael Brent Bailey , Andrew John Eis , Robert Lee Pipkin , Eric Bivens
- Applicant: Tommy Stewart , Michael Brent Bailey , Andrew John Eis , Robert Lee Pipkin , Eric Bivens
- Applicant Address: US OK Duncan
- Assignee: Halliburton Energy Services, Inc.
- Current Assignee: Halliburton Energy Services, Inc.
- Current Assignee Address: US OK Duncan
- Agency: Conley Rose, P.C.
- Agent John W. Wustenberg
- Main IPC: E21B43/26
- IPC: E21B43/26 ; E21B33/12
Abstract:
A bottom hole assembly is provided. The bottom hole assembly comprises an upper component, a lower component and a telescoping assembly disposed between the upper component and the lower component.
Public/Granted literature
- US20120097396A1 Bottom hole assembly Public/Granted day:2012-04-26
Information query
