发明授权
US08513060B2 Manufacturing method using multi-step adhesive curing for sealed semiconductor device
有权
用于密封半导体器件的多步粘合剂固化的制造方法
- 专利标题： Manufacturing method using multi-step adhesive curing for sealed semiconductor device
- 专利标题（中）： 用于密封半导体器件的多步粘合剂固化的制造方法
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申请号： US13559397申请日： 2012-07-26
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公开(公告)号： US08513060B2公开(公告)日： 2013-08-20
- 发明人: Hiroaki Narita
- 申请人： Hiroaki Narita
- 申请人地址： JP Kawasaki-shi, Kanagawa
- 专利权人： Renesas Electronics Corporation
- 当前专利权人： Renesas Electronics Corporation
- 当前专利权人地址： JP Kawasaki-shi, Kanagawa
- 代理机构： Womble Carlyle
- 优先权： JP2011-172907 20110808
- 主分类号： H01L21/78
- IPC分类号： H01L21/78
摘要：
A method for forming a sealing body without cracks in manufacture of a semiconductor device having an external terminal formed through the use of an electrolysis plating method. A front surface of a semiconductor wafer is placed over a front surface of a first support heated to a first temperature. An adhesive sheet is then bonded to a back surface of the semiconductor wafer, after which the semiconductor wafer is subjected to heat treatment at a second temperature higher than the first temperature. After the semiconductor wafer and the adhesive sheet are cut along cutting regions, a plurality of semiconductor chips each having an adhesive patch bonded thereto are obtained. A mother substrate is placed over a front surface of a second support heated to a third temperature and the semiconductor chips are fixed to an upper surface of the mother substrate via the adhesive patch.
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