Invention Grant
- Patent Title: Composite microphone boot to optimize sealing and mechanical properties
- Patent Title (中): 复合麦克风引擎优化密封和机械性能
-
Application No.: US12859711Application Date: 2010-08-19
-
Publication No.: US08515113B2Publication Date: 2013-08-20
- Inventor: Fletcher R. Rothkopf , Phillip M. Hobson , Adam Mittleman , Anna-Katrina Shedletsky
- Applicant: Fletcher R. Rothkopf , Phillip M. Hobson , Adam Mittleman , Anna-Katrina Shedletsky
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Dorsey & Whitney LLP
- Main IPC: H04R9/08
- IPC: H04R9/08
Abstract:
A microphone assembly for an electronic device is described. The microphone assembly can include a microphone, a microphone boot and a printed circuit board. The microphone boot can be a composite microphone boot that is formed from multiple materials. A hardness of the each of the materials used in the microphone boot can be selected to improve sealing integrity and reduce shock transmission. In one embodiment, the composite microphone boot can be formed using a double-shot injection molding process.
Public/Granted literature
- US20120046780A1 COMPOSITE MICROPHONE BOOT TO OPTIMIZE SEALING AND MECHANICAL PROPERTIES Public/Granted day:2012-02-23
Information query
