发明授权
- 专利标题: Ultrasonic sensor module attaching device and attaching method
- 专利标题(中): 超声波传感器模块连接装置及附件方法
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申请号: US13256139申请日: 2009-06-15
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公开(公告)号: US08516911B2公开(公告)日: 2013-08-27
- 发明人: Satoru Inoue , Yukio Nishimoto , Toru Matsumoto
- 申请人: Satoru Inoue , Yukio Nishimoto , Toru Matsumoto
- 申请人地址: JP Tokyo
- 专利权人: Mitsubishi Electric Corporation
- 当前专利权人: Mitsubishi Electric Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Birch, Stewart, Kolasch & Birch, LLP
- 国际申请: PCT/JP2009/002700 WO 20090615
- 国际公布: WO2010/146618 WO 20101223
- 主分类号: G01D21/00
- IPC分类号: G01D21/00 ; G08B23/00
摘要:
An ultrasonic sensor module attaching device and attaching method include an ultrasonic sensor module 1 having a flange 7 of which the diameter is larger than the hole diameter of a through hole 5 prepared through a bumper 4 of a vehicle; and a fixing ring plate 3 having an engaging section 3b with the flange of the ultrasonic sensor module temporarily fixed on the back of the bumper 4 and a large-diameter fixing section 3c which extends circumferentially of the engaging section and is fixed to the back of the bumper 4; thus, the necessity for positioning the fixing ring plate 3 to the hole 5 of the bumper 4 is eliminated, which can attach easily the ultrasonic sensor module 1 to the back of the bumper.
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