Invention Grant
- Patent Title: Electronic device and manufacturing method thereof
- Patent Title (中): 电子装置及其制造方法
-
Application No.: US12703495Application Date: 2010-02-10
-
Publication No.: US08518190B2Publication Date: 2013-08-27
- Inventor: Wen-Hsiung Liao , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
- Applicant: Wen-Hsiung Liao , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
- Applicant Address: TW Hsinchu
- Assignee: Cyntec Co., Ltd.
- Current Assignee: Cyntec Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Birch Stewart Kolasch & Birch LLP
- Priority: TW98116158A 20090515
- Main IPC: H01F1/14
- IPC: H01F1/14 ; H01F1/153 ; H01F17/04
Abstract:
An electronic device including a magnetic body and a wire is provided. The magnetic body has a first magnetic powder and a second magnetic powder mixed with the first magnetic powder. The Vicker's Hardness of the first magnetic powder is greater than that of the second magnetic powder and the mean particle diameter of the first magnetic powder is greater than that of the second magnetic powder.
Public/Granted literature
- US20100289609A1 ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2010-11-18
Information query
