发明授权
- 专利标题: Layered structure
- 专利标题(中): 分层结构
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申请号: US10581188申请日: 2004-11-30
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公开(公告)号: US08518553B2公开(公告)日: 2013-08-27
- 发明人: Chandra Venkatraman , Keith Majeroni , Daniel Kester
- 申请人: Chandra Venkatraman , Keith Majeroni , Daniel Kester
- 申请人地址: DE Bergisch Gladbach
- 专利权人: Sulzer Metaplas GmbH
- 当前专利权人: Sulzer Metaplas GmbH
- 当前专利权人地址: DE Bergisch Gladbach
- 代理机构: Foley & Lardner LLP
- 国际申请: PCT/EP2004/013676 WO 20041130
- 国际公布: WO2005/054540 WO 20050616
- 主分类号: B22F3/00
- IPC分类号: B22F3/00
摘要:
The invention relates to a layered structure comprising a first intermediate layer, said first intermediate layer comprising at least one element of group IVB, group VB or group VIB; a second intermediate layer deposited on top of said first intermediate layer, said second intermediate layer comprising a diamond-like nanocomposite composition; a diamond-like carbon layer deposited on top of said second intermediate layer. The invention further relates to the use of a substrate coated with such a layered structure for high shear and/or high impact applications and to a method to cover a substrate with such a layered structure.
公开/授权文献
- US20080166287A1 Layered Structure 公开/授权日:2008-07-10
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