发明授权
- 专利标题: Semiconductor device and manufacturing method thereof
- 专利标题(中): 半导体装置及其制造方法
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申请号: US13082468申请日: 2011-04-08
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公开(公告)号: US08519509B2公开(公告)日: 2013-08-27
- 发明人: Kosei Noda , Seiji Yasumoto , Kensuke Yoshizumi , Toshiyuki Miyamoto
- 申请人: Kosei Noda , Seiji Yasumoto , Kensuke Yoshizumi , Toshiyuki Miyamoto
- 申请人地址: JP Atsugi-shi, Kanagawa-ken
- 专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人地址: JP Atsugi-shi, Kanagawa-ken
- 代理机构: Robinson Intellectual Property Law Offices, P.C.
- 代理商 Eric J. Robinson
- 优先权: JP2010-095243 20100416
- 主分类号: H01L29/00
- IPC分类号: H01L29/00 ; H01L29/04 ; H01L31/036 ; H01L27/10
摘要:
An object of one embodiment of the present invention is to provide an antifuse which has low writing voltage. The antifuse is used for a memory element for a read only memory device. The antifuse includes a first conductive layer, an insulating layer, a semiconductor layer, and a second conductive layer. The insulating layer included in the antifuse is a silicon oxynitride layer formed by adding ammonia to a source gas. When hydrogen is contained in the layer at greater than or equal to 1.2×1021 atoms/cm3 and less than or equal to 3.4×1021 atoms/cm3 or nitrogen is contained in the layer at greater than or equal to 3.2×1020 atoms/cm3 and less than or equal to 2.2×1021 atoms/cm3, writing can be performed at low voltage.
公开/授权文献
- US20110254122A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 公开/授权日:2011-10-20
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