Invention Grant
- Patent Title: Wiring method and wiring system for structures
- Patent Title (中): 结构接线方式及布线系统
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Application No.: US13666306Application Date: 2012-11-01
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Publication No.: US08519571B2Publication Date: 2013-08-27
- Inventor: Ichirou Yoshida , Kimiaki Tanaka
- Applicant: Denso Corporation
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Posz Law Group, PLC
- Priority: JP2009-182779 20090805; JP2010-066903 20100323
- Main IPC: H01B7/30
- IPC: H01B7/30

Abstract:
A unitized wiring portion (wiring unit) has a hard pipe member, a wire provided in the pipe member, and outside wiring connectors connected at each end of the wire. A plurality of wiring units are prepared in advance wherein wiring units are divided into multiple groups having different length of wires and so on. The wiring units are arranged in a structure (e.g. a vehicle body) and the outside wiring connectors are connected to each other to form a wiring network. The wiring units are fixed to frame and/or reinforcing members to thereby increase mechanical strength of the structure.
Public/Granted literature
- US20130057062A1 WIRING METHOD AND WIRING SYSTEM FOR STRUCTURES Public/Granted day:2013-03-07
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