Invention Grant
- Patent Title: Laminated electronic component
- Patent Title (中): 层压电子部件
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Application No.: US13045585Application Date: 2011-03-11
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Publication No.: US08520361B2Publication Date: 2013-08-27
- Inventor: Akihiro Motoki , Syunsuke Takeuchi , Makoto Ogawa , Kenichi Kawasaki
- Applicant: Akihiro Motoki , Syunsuke Takeuchi , Makoto Ogawa , Kenichi Kawasaki
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2010-067492 20100324
- Main IPC: H01G4/228
- IPC: H01G4/228

Abstract:
A laminated electronic component includes a first plating film that defines a base for external terminal electrodes and that includes a plurality of layers including a first layer made of, for example, copper and a second layer provided on the first layer. The total thickness of the first plating film is about 3 μm to about 15 μm, and the thickness of the second layer is about 2 to 10 times as thick as the thickness of the first layer. The first layer is formed by electroless plating, and the second layer is formed by electrolytic plating. This formation results in a grain size of about 0.5 μm or more of a metal grain included in the second layer, and thus makes the film less susceptible to oxidation.
Public/Granted literature
- US20110236658A1 LAMINATED ELECTRONIC COMPONENT Public/Granted day:2011-09-29
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