发明授权
- 专利标题： Apparatuses and methods for dissipating heat from a computer component
- 专利标题（中）： 从计算机部件散热的装置和方法
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申请号： US12867849申请日： 2008-04-01
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公开(公告)号： US08520393B2公开(公告)日： 2013-08-27
- 发明人: Steven S. Homer , Dustin L. Hoffman , Jeffrey A. Lev , Mark S. Tracy , Luis C. Armendariz , Mark H. Ruch
- 申请人： Steven S. Homer , Dustin L. Hoffman , Jeffrey A. Lev , Mark S. Tracy , Luis C. Armendariz , Mark H. Ruch
- 申请人地址： US TX Houston
- 专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人地址： US TX Houston
- 国际申请： PCT/US2008/058986 WO 20080401
- 国际公布： WO2009/123618 WO 20091008
- 主分类号： H05K7/20
- IPC分类号： H05K7/20
摘要：
Heat dissipation apparatus for dissipating heat generated by a heat-generating component mounted to a circuit board. In one embodiment, the heat dissipation apparatus includes a thermally-conductive heat sink adapted to be placed in contact with the heat-generating component, a bracket adapted to hold the heat sink in place relative to the heat-generating component, and a single coil spring mounted to the bracket adapted to urge the heat sink into contact with the heat-generating component.