Invention Grant
- Patent Title: Liquid ejecting head and liquid ejecting apparatus
- Patent Title (中): 液体喷头和液体喷射装置
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Application No.: US13664660Application Date: 2012-10-31
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Publication No.: US08523326B2Publication Date: 2013-09-03
- Inventor: Katsumi Enomoto , Shunsuke Watanabe , Yuma Fukuzawa , Satoshi Oguchi
- Applicant: Seiko Epson Corporation
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2011-246065 20111110
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16

Abstract:
A head unit fixed to a case in a position in which a nozzle forming surface thereof faces a first surface side of a head fixing portion, and a wiring substrate is arranged on a second surface side opposite from the first surface on a portion. A supply flow channel in the case communicate with a common liquid chamber at an end portion of the communicating flow channel in a first direction, and a flexible cable is disposed inside the supply flow channel in the case in the first direction.
Public/Granted literature
- US20130120501A1 Liquid Ejecting Head and Liquid Ejecting Apparatus Public/Granted day:2013-05-16
Information query
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