Invention Grant
- Patent Title: Terminal block and terminal block manufacturing method
- Patent Title (中): 接线端子和接线端子制造方法
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Application No.: US13293585Application Date: 2011-11-10
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Publication No.: US08523604B2Publication Date: 2013-09-03
- Inventor: Daisuke Akuta
- Applicant: Daisuke Akuta
- Applicant Address: JP
- Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee Address: JP
- Agent Gerald E. Hespos; Michael J. Porco; Matthew T. Hespos
- Priority: JP2011-010033 20110120
- Main IPC: H01R11/00
- IPC: H01R11/00

Abstract:
A terminal block has conductors extending from devices placed one over another placed on nuts (10) and fastened by a bolt. A heat sink (40) is arranged below the nuts and an insulating plate (20) is sandwiched in close contact with the nuts (10) and the heat sink (40). A molded resin part (60) covers these three members (10, 20 and 40). The insulating plate (20) includes nut accommodating portions (21) capable of accommodating the nuts (10) and bolt escaping recesses (26) projecting downward from a bottom plate (22) of the insulating plate (20). The heat sink (40) includes accommodation recesses (43) into which the bolt escaping recesses (26) fit. The molded resin part (60) is molded with the nuts (10) accommodated in the nut accommodating portions (21) and the accommodation recesses (43) and the bolt escaping recesses (26) fit to each other.
Public/Granted literature
- US20120186872A1 TERMINAL BLOCK AND TERMINAL BLOCK MANUFACTURING METHOD Public/Granted day:2012-07-26
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