发明授权
- 专利标题： Method for making wafer level image module
- 专利标题（中）： 制造晶圆级图像模块的方法
-
申请号： US12539309申请日： 2009-08-11
-
公开(公告)号： US08524521B2公开(公告)日： 2013-09-03
- 发明人: Hsiao-Wen Lee , Pai-Chun Peter Zung , Tzu-Han Lin
- 申请人： Hsiao-Wen Lee , Pai-Chun Peter Zung , Tzu-Han Lin
- 申请人地址： TW Hsinchu US CA Santa Clara
- 专利权人： VisEra Technologies Company Limited,OmniVision Technologies, Inc.
- 当前专利权人： VisEra Technologies Company Limited,OmniVision Technologies, Inc.
- 当前专利权人地址： TW Hsinchu US CA Santa Clara
- 代理机构： Muncy, Geissler, Olds & Lowe, PLLC
- 优先权： TW94134100A 20050929
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A wafer level image module includes a photo sensor for outputting an electrical signal upon receiving light, a lens set for focusing incident light onto the photo sensor, and an adjustment member disposed between the photo sensor and the lens set for controlling the distance between the photo sensor and the lens set to compensate the focus offset of the photo sensor for enabling the lens set to accurately focus the incident light onto the photo sensor in an in-focus manner so as to provide a high image quality.
公开/授权文献
- US20090294639A1 WAFER LEVEL IMAGE MODULE 公开/授权日：2009-12-03
信息查询
IPC分类:
