Invention Grant
- Patent Title: MEMS device having chip scale packaging
- Patent Title (中): 具有芯片级封装的MEMS器件
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Application No.: US13213863Application Date: 2011-08-19
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Publication No.: US08525278B2Publication Date: 2013-09-03
- Inventor: Chia-Hua Chu , Chung-Hsien Lin
- Applicant: Chia-Hua Chu , Chung-Hsien Lin
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L27/20
- IPC: H01L27/20 ; H01L21/98
Abstract:
A method and device having chip scale MEMS packaging is described. A first substrate includes a MEMS device and a second substrate includes an integrated circuit. The frontside of the first substrate is bonded to the backside of the second substrate. Thus, the second substrate provides a cavity to encase, protect or operate the MEMS device within. The bond may provide an electrical connection between the first and second substrate. In an embodiment, a through silicon via is used to carry the signals from the first substrate to an I/O connection on the frontside of the second substrate.
Public/Granted literature
- US20130043547A1 MEMS DEVICE HAVING CHIP SCALE PACKAGING Public/Granted day:2013-02-21
Information query
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