发明授权
- 专利标题： Printed circuit board having different sub-core layers and semicondutor package comprising the same
- 专利标题（中）： 具有不同子芯层的印刷电路板和包括其的半导体封装
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申请号： US13240083申请日： 2011-09-22
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公开(公告)号： US08525341B2公开(公告)日： 2013-09-03
- 发明人: Hyun-Ki Kim , Dae-Young Choi , Mi-Yeon Kim
- 申请人： Hyun-Ki Kim , Dae-Young Choi , Mi-Yeon Kim
- 申请人地址： KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- 代理机构： Muir Patent Consulting, PLLC
- 优先权： KR10-2010-0139485 20101230
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H05K1/09 ; H05K1/02 ; H05K1/00
摘要：
Provided are a printed circuit board (PCB) and a semiconductor package including the same. The PCB includes a core layer having a stacked structure including at least a first layer made of a first material that has a first coefficient of thermal expansion (CTE) and a second layer made of a second material that has a second CTE different from the first CTE, an upper wiring layer disposed on a first surface of the core layer, and a lower wiring layer disposed on a second surface of the core layer opposite the first surface.