发明授权
- 专利标题： Microspring structures adapted for target device cooling
- 专利标题（中）： 适用于目标器件冷却的微弹簧结构
-
申请号： US13330316申请日： 2011-12-19
-
公开(公告)号： US08525353B2公开(公告)日： 2013-09-03
- 发明人: Eugene M. Chow , Eric J. Shrader , John S. Paschkewitz
- 申请人： Eugene M. Chow , Eric J. Shrader , John S. Paschkewitz
- 申请人地址： US CA Palo Alto
- 专利权人： Palo Alto Research Center Incorporated
- 当前专利权人： Palo Alto Research Center Incorporated
- 当前专利权人地址： US CA Palo Alto
- 代理商 Jonathan A. Small
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52 ; H01L29/40
摘要：
In a system for providing temporary or permanent connection of an integrated circuit die to a base substrate using electrical microsprings, a thermal element is provided that assists with cooling of the pad structure during use. The thermal element may be formed of the same material and my similar processes as the microsprings. The thermal element may be one or more block structures or one or more thermal microsprings. The thermal element may be provided with channels to contain and/or direct the flow of a thermal transfer fluid. Cooling of components associated with the pad structure (e.g., ICs) may be provided.
公开/授权文献
- US20130154127A1 Microspring Structures Adapted for Target Device Cooling 公开/授权日：2013-06-20
信息查询
IPC分类:
