Invention Grant
US08525569B2 Synchronizing global clocks in 3D stacks of integrated circuits by shorting the clock network
有权
通过短时钟网络同步3D堆叠集成电路中的全局时钟
- Patent Title: Synchronizing global clocks in 3D stacks of integrated circuits by shorting the clock network
- Patent Title (中): 通过短时钟网络同步3D堆叠集成电路中的全局时钟
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Application No.: US13217335Application Date: 2011-08-25
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Publication No.: US08525569B2Publication Date: 2013-09-03
- Inventor: Thomas J. Bucelot , Liang-Teck Pang , Phillip J. Restle
- Applicant: Thomas J. Bucelot , Liang-Teck Pang , Phillip J. Restle
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Louis J. Percello
- Main IPC: G06F1/04
- IPC: G06F1/04

Abstract:
There is provided a clock distribution network for synchronizing global clock signals within a 3D chip stack having two or more strata. On each of the two or more strata, the clock distribution network includes a clock grid having a plurality of sectors for providing the global clock signals to various chip locations, a multiple-level buffered clock tree for driving the clock grid and including at least a root and a plurality of clock buffers, and one or more multiplexers for providing the global clock signals to at least a portion of the buffered clock tree. Inputs of at least some of the plurality of clock buffers on each of the two or more strata are shorted together using chip-to-chip interconnects to reduce skewing of the global clock signals with respect to the various chip locations.
Public/Granted literature
- US20130049827A1 SYNCHRONIZING GLOBAL CLOCKS IN 3D STACKS OF INTEGRATED CIRCUITS BY SHORTING THE CLOCK NETWORK Public/Granted day:2013-02-28
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