发明授权
- 专利标题: Feedthrough multilayer capacitor
- 专利标题(中): 馈通多层电容器
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申请号: US13415431申请日: 2012-03-08
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公开(公告)号: US08526162B2公开(公告)日: 2013-09-03
- 发明人: Masaaki Togashi , Takashi Aoki , Hiroshi Okuyama , Yutaro Kotani
- 申请人: Masaaki Togashi , Takashi Aoki , Hiroshi Okuyama , Yutaro Kotani
- 申请人地址: JP Tokyo
- 专利权人: TDK Corporation
- 当前专利权人: TDK Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Oliff & Berridge, PLC
- 优先权: JP2011-082877 20110404
- 主分类号: H01G4/35
- IPC分类号: H01G4/35 ; H01G4/005
摘要:
A conducting portion includes a plurality of conducting inner electrodes. Each of a pair of capacitance portions includes a plurality of signal inner electrodes while adjacently opposing each other in the laminating direction, a plurality of first grounding inner electrodes while adjacently opposing each other in the laminating direction, and a plurality of second grounding inner electrodes while adjacently opposing each other in the laminating direction. The plurality of first grounding inner electrodes are located between the conducting portion and the plurality of signal inner electrodes, while one of the first grounding inner electrodes adjacently opposes one of the first signal inner electrodes in the laminating direction. The plurality of second grounding inner electrodes are located between principal faces opposing each other in the laminating direction in the outer surface and the plurality of signal inner electrodes.
公开/授权文献
- US20120250218A1 FEEDTHROUGH MULTILAYER CAPACITOR 公开/授权日:2012-10-04