Invention Grant
- Patent Title: Earphone and acoustic transducer
- Patent Title (中): 耳机和声学传感器
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Application No.: US13267287Application Date: 2011-10-06
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Publication No.: US08526659B2Publication Date: 2013-09-03
- Inventor: Koji Nageno , Takahiro Suzuki , Takeshi Hara
- Applicant: Koji Nageno , Takahiro Suzuki , Takeshi Hara
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Wolf, Greenfield & Sacks, P.C.
- Priority: JPP2010-229527 20101012
- Main IPC: H04R25/00
- IPC: H04R25/00

Abstract:
An earphone includes an earphone casing inside which a sound path that guides sound to a sound discharging hole is formed, and an acoustic transducer disposed inside the earphone casing. The acoustic transducer includes an accommodation casing having accommodated therein a yoke on which paired magnets disposed so as to face each other are mounted, a coil to which a driving current is supplied, an armature provided with a vibrating part vibrating when the driving current is supplied to the coil, the vibrating part being disposed between the paired magnets, and a diaphragm coupled to the vibrating part of the armature, a sound output hole is formed on a surface that faces a vibration surface of the diaphragm in the accommodation casing, and the acoustic transducer has the sound output hole disposed in the earphone casing so that the sound output hole is acoustically coupled to the sound path.
Public/Granted literature
- US20120087533A1 EARPHONE AND ACOUSTIC TRANSDUCER Public/Granted day:2012-04-12
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