Invention Grant
- Patent Title: Method for mounting electronic parts
- Patent Title (中): 电子零件安装方法
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Application No.: US13619726Application Date: 2012-09-14
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Publication No.: US08528197B2Publication Date: 2013-09-10
- Inventor: Jun-Kyu Park , Sang-Mun Shin , Gweon-Young Park , Byung-Chul Lee
- Applicant: Jun-Kyu Park , Sang-Mun Shin , Gweon-Young Park , Byung-Chul Lee
- Applicant Address: KR Seoul
- Assignee: LG Display Co., Ltd.
- Current Assignee: LG Display Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2009-0071603 20090804
- Main IPC: H05K3/30
- IPC: H05K3/30 ; H05K3/20

Abstract:
An electronic part mounting method including introducing electronic parts in a bulk form into a bulk feeder, transferring the introduced electronic parts to at least one inspection unit by use of a rotatably installed positioning wheel, inspecting and aligning the electronic parts, transferring the inspected and aligned electronic parts to a part insertion unit by use of the positioning wheel, inserting the electronic parts, determined as good ones by the inspection unit, into the part insertion unit, and picking up the electronic parts received in the part insertion unit to mount the electronic parts on a board.
Public/Granted literature
- US20130008017A1 METHOD FOR MOUNTING ELECTRONIC PARTS Public/Granted day:2013-01-10
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