A multilayer printed circuit board includes a first conductive layer including (i) a first signal ground, (ii) a first frame ground mounted on an external interface component, (iii) a first slit portion that separates the first signal ground and the first frame ground from each other, and (iv) a signal wiring arranged to extend over the first slit portion. A second conductive layer is laminated on the first conductive layer through a dielectric layer. The second conductive layer includes (i) a second signal ground, (ii) a second frame ground, and (iii) a second slit portion that separates the second signal ground and the second frame ground from each other. A first connecting member and a second connecting member connect the second signal ground and the second frame ground to each other. The first connecting member and the second connecting member are arranged along the signal wiring on a different side, such that the first connecting member and the second connecting member sandwich the signal wiring and extend over the second slit portion.