Invention Grant
- Patent Title: Printed circuit board having adaptable wiring lines and method for manufacturing the same
- Patent Title (中): 具有适应性布线的印刷电路板及其制造方法
-
Application No.: US12329769Application Date: 2008-12-08
-
Publication No.: US08530754B2Publication Date: 2013-09-10
- Inventor: Shin Young Park
- Applicant: Shin Young Park
- Applicant Address: KR Gyeonggi-do
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Ladas & Parry LLP
- Priority: KR10-2008-0021586 20080307
- Main IPC: H05K1/11
- IPC: H05K1/11
Abstract:
A printed circuit board having adaptable wiring lines includes an insulation layer. Electrode terminals and ball lands are formed on an upper surface of the insulation layer and are separated from each other. Wiring patterns are formed on the insulation layer, interposed between the electrode terminals and the ball lands, and partially removed in a region between the electrode terminals and the ball lands. Conductive members are selectively formed in the regions where the wiring patterns are partially removed to selectively connect the electrode terminals and the ball lands.
Public/Granted literature
- US20090223709A1 PRINTED CIRCUIT BOARD HAVING ADAPTABLE WIRING LINES AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2009-09-10
Information query
