A radiation-sensitive apparatus includes a first substrate, a radiation-sensitive layer, a plurality of spatially separated integrated circuits, each integrated circuit having: a second substrate, one or more electronic circuit(s) formed in or on the second substrate, and one or more electrode connection pads formed in or on the second substrate, each electrode connection pad electrically connected to at least one of the electronic circuit(s). Pixel electrodes are formed over the first substrate separate from the integrated circuit, each pixel electrode electrically connected to an electrode connection pad. An electronic control circuit is electrically connected to each electronic circuit in each integrated circuit. The electronic circuits are responsive to electrical signals formed by the interaction of electromagnetic radiation and the radiation-sensitive layer, the electrical signals conducted by the pixel electrodes and electrode connection pads.