Invention Grant
- Patent Title: Solid-state image pickup element, method of manufacturing the same, and electronic apparatus
- Patent Title (中): 固体摄像元件及其制造方法以及电子设备
-
Application No.: US13050362Application Date: 2011-03-17
-
Publication No.: US08530945B2Publication Date: 2013-09-10
- Inventor: Taketo Fukuro , Jun Okuno
- Applicant: Taketo Fukuro , Jun Okuno
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Dentons US LLP
- Priority: JPP2010-072498 20100326
- Main IPC: H01L31/0216
- IPC: H01L31/0216

Abstract:
A solid-state image pickup element includes: a photoelectric conversion region formed in a semiconductor substrate; an electric charge holding region formed in the semiconductor substrate for holding electric charges accumulated in the photoelectric conversion region until the electric charges are read out; a transfer gate formed on the semiconductor substrate for transferring electric charges generated by photoelectric conversion in the photoelectric conversion region to the electric charge holding region, and a light blocking film formed on an upper surface of the transfer gate. In this case, a portion between the semiconductor substrate and the light blocking film is thinly formed as a light made incident to the photoelectric conversion region has a longer wavelength in a wavelength region.
Public/Granted literature
- US20110233707A1 SOLID-STATE IMAGE PICKUP ELEMENT, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS Public/Granted day:2011-09-29
Information query
IPC分类: