Invention Grant
US08531197B2 Integrated circuit die, an integrated circuit package and a method for connecting an integrated circuit die to an external device
有权
集成电路管芯，集成电路封装以及将集成电路管芯连接到外部器件的方法
- Patent Title: Integrated circuit die, an integrated circuit package and a method for connecting an integrated circuit die to an external device
- Patent Title (中): 集成电路管芯，集成电路封装以及将集成电路管芯连接到外部器件的方法
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Application No.: US13054122Application Date: 2008-07-17
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Publication No.: US08531197B2Publication Date: 2013-09-10
- Inventor: Yefim-Haim Fefer , Valery Neiman , Sergey Sofer
- Applicant: Yefim-Haim Fefer , Valery Neiman , Sergey Sofer
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- International Application: PCT/IB2008/052872 WO 20080717
- International Announcement: WO2010/007472 WO 20100121
- Main IPC: G01R31/3187
- IPC: G01R31/3187
Abstract:
An integrated circuit die comprises an electronic circuit and one or more output ports for outputting signals from the die via an external impedance, to a load, external from the die. The output port is connected to the electronic circuit. The die is further provided with an on-die sampling oscilloscope circuit connected to the output port, for measuring a waveform of the outputted signals.
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Information query
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