发明授权
US08531806B2 Distributed building blocks of R-C clamping circuitry in semiconductor die core area
有权
半导体芯片区域中R-C钳位电路的分布式构建块
- 专利标题： Distributed building blocks of R-C clamping circuitry in semiconductor die core area
- 专利标题（中）： 半导体芯片区域中R-C钳位电路的分布式构建块
-
申请号： US13173977申请日： 2011-06-30
-
公开(公告)号： US08531806B2公开(公告)日： 2013-09-10
- 发明人: Reza Jalilizeinali , Evan Siansuri , Sreeker R. Dundigal , Eugene R. Worley
- 申请人： Reza Jalilizeinali , Evan Siansuri , Sreeker R. Dundigal , Eugene R. Worley
- 申请人地址： US CA San Diego
- 专利权人： QUALCOMM Incorporated
- 当前专利权人： QUALCOMM Incorporated
- 当前专利权人地址： US CA San Diego
- 代理商 Sam Talpalatsky; Nicholas J. Pauley; Joseph Agusta
- 主分类号： H02H3/22
- IPC分类号： H02H3/22
摘要：
A semiconductor die includes resistor-capacitor (RC) clamping circuitry for electrostatic discharge (ESD) protection of the semiconductor die. The RC clamping circuitry includes building blocks distributed in the pad ring and in the core area of the semiconductor die. The building blocks include at least one capacitor block in the core area. The RC clamping circuitry also includes chip level conductive layer connections between each of the distributed building blocks.
公开/授权文献
信息查询
