发明授权
- 专利标题: Pad mechanism capable of adjusting height thereof and electronic device therewith
- 专利标题(中): 能够调整其高度的垫片机构和电子设备
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申请号: US13330621申请日: 2011-12-19
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公开(公告)号: US08531837B2公开(公告)日: 2013-09-10
- 发明人: Jia-Hung Lee , Chien-Heng Kuo , Yen-Chang Lai
- 申请人: Jia-Hung Lee , Chien-Heng Kuo , Yen-Chang Lai
- 申请人地址: TW Hsichih, New Taipei
- 专利权人: Wistron Corporation
- 当前专利权人: Wistron Corporation
- 当前专利权人地址: TW Hsichih, New Taipei
- 代理商 Winston Hsu; Scott Margo
- 优先权: TW100123833A 20110706
- 主分类号: H05K5/00
- IPC分类号: H05K5/00
摘要:
A pad mechanism includes a step fixing structure having a plurality of step platforms. A height difference is formed between the two step platforms. A first engaging portion is formed on each step platform. The pad mechanism further includes a pad component having a pad body, a sleeve and a constraining portion. A second engaging portion is formed on the pad body for selectively engaging with the corresponding first engaging portion so as to adjust a height of the pad body protruding from the step fixing structure. The pad mechanism further includes a resilient component sheathing with the sleeve for driving the sleeve, and a constraining component installed on a side of the resilient component and connected to the constraining portion so as to prevent the resilient component from separating from the sleeve.
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