A laser diode arrangement having a multiplicity of laser diodes (11) arranged along side one another, comprises a heat sink (9) on which the laser diodes (11) are mounted and a cooling body (1) which is in intimate contact with the heat sink (9), wherein the cooling body (1) has two coolant channels (2; 3), which run parallel to the longitudinal axis of the heat sink (9) and are embodied as a feed channel (2) and as a discharge channel (3) for a coolant. According to the invention a multiplicity of cooling channels (5, 7; 6, 8) lying along side one another are provided, which branch off from the feed channel (2), lead past the heat sink (9), and open into the discharge channel (3), wherein cooling channels (5, 7; 6, 8) lying directly alongside one another branch off at different locations of the periphery of the feed channel (2) and of the discharge channel (3).