发明授权
- 专利标题： Polymer composition for microelectronic assembly
- 专利标题（中）： 用于微电子组装的聚合物组合物
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申请号： US13299710申请日： 2011-11-18
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公开(公告)号： US08535454B2公开(公告)日： 2013-09-17
- 发明人: Christopher Apanius , Andrew Bell , Leah Langsdorf , W. C. Peter Tsang
- 申请人： Christopher Apanius , Andrew Bell , Leah Langsdorf , W. C. Peter Tsang
- 申请人地址： US OH Brecksville
- 专利权人： Promerus, LLC
- 当前专利权人： Promerus, LLC
- 当前专利权人地址： US OH Brecksville
- 代理商 Balaram Gupta
- 主分类号： B23K35/34
- IPC分类号： B23K35/34
摘要：
Embodiments in accordance with the present invention encompass polymer compositions that are useful in the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions providing for both holding the microelectronic components at desired positions on a substrate, providing fluxing for the solder bonding of such components to the substrate and remaining in place as an underfill for such components.
公开/授权文献
- US20120298729A1 Polymer Composition for Microelectronic Assembly 公开/授权日：2012-11-29
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