Invention Grant
- Patent Title: Transparent molding composition
- Patent Title (中): 透明成型组合物
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Application No.: US13150683Application Date: 2011-06-01
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Publication No.: US08535811B2Publication Date: 2013-09-17
- Inventor: Kirsten Luetzeler , Franz-Erich Baumann , Sonja Bollmann , Andreas Dowe , Roland Wursche , Georg Schaefer
- Applicant: Kirsten Luetzeler , Franz-Erich Baumann , Sonja Bollmann , Andreas Dowe , Roland Wursche , Georg Schaefer
- Applicant Address: DE Essen
- Assignee: Evonik Degussa GmbH
- Current Assignee: Evonik Degussa GmbH
- Current Assignee Address: DE Essen
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: DE102005026264 20050608
- Main IPC: B32B27/00
- IPC: B32B27/00 ; B32B27/34
Abstract:
A polyamide molding composition which can be used for production of a printable or printed item contains a) at most 90 parts by weight of a polyamide obtained from a lactam or from an amino carboxylic acid having at least 10 carbon atoms; and b) from 10 to 100 parts by weight of PA1010, wherein a total of components a) and b) is 100 parts by weight.
Public/Granted literature
- US20110244209A1 TRANSPARENT MOLDING COMPOSITION Public/Granted day:2011-10-06
Information query
