Invention Grant
US08535985B2 Method of making a semiconductor chip assembly with a bump/base heat spreader and an inverted cavity in the bump
失效
制造具有凸块/基底散热器的半导体芯片组件和凸块中的倒置腔的方法
- Patent Title: Method of making a semiconductor chip assembly with a bump/base heat spreader and an inverted cavity in the bump
- Patent Title (中): 制造具有凸块/基底散热器的半导体芯片组件和凸块中的倒置腔的方法
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Application No.: US13052073Application Date: 2011-03-20
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Publication No.: US08535985B2Publication Date: 2013-09-17
- Inventor: Charles W. C. Lin , Chia-Chung Wang
- Applicant: Charles W. C. Lin , Chia-Chung Wang
- Applicant Address: TW Taipei
- Assignee: Bridge Semiconductor Corporation
- Current Assignee: Bridge Semiconductor Corporation
- Current Assignee Address: TW Taipei
- Agency: Jackson IPG PLLC
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method of making a semiconductor chip assembly includes providing a bump and a ledge, mounting an adhesive on the ledge including inserting the bump into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the bump with an aperture in the conductive layer, then flowing the adhesive between the bump and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, then mounting a semiconductor device on the bump opposite a cavity in the bump, wherein a heat spreader includes the bump and a base that includes a portion of the ledge adjacent to the bump, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.
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