发明授权
- 专利标题： Coreless layer buildup structure with LGA
- 专利标题（中）： 具有LGA的无芯层堆积结构
-
申请号： US12764994申请日： 2010-04-22
-
公开(公告)号： US08536459B2公开(公告)日： 2013-09-17
- 发明人: Voya Markovich , Timothy Antesberger , Frank D. Egitto , William Wilson , Rabindra N. Das
- 申请人： Voya Markovich , Timothy Antesberger , Frank D. Egitto , William Wilson , Rabindra N. Das
- 申请人地址： US NY Endicott
- 专利权人： Endicott Interconnect Technologies, Inc.
- 当前专利权人： Endicott Interconnect Technologies, Inc.
- 当前专利权人地址： US NY Endicott
- 代理机构： Bond Schoeneck & King, PLLC
- 主分类号： H05K1/03
- IPC分类号： H05K1/03 ; H05K1/02 ; H05K1/09
摘要：
A substrate for use in a PCB or PWB board having a coreless buildup layer and at least one metal and at least one dielectric layer. The coreless buildup dielectric layers can consist of at least partially cured thermoset resin and thermoplastic resin. The substrate may also contain land grid array (LGA) packaging.
公开/授权文献
- US20120160544A1 CORELESS LAYER BUILDUP STRUCTURE WITH LGA 公开/授权日：2012-06-28
信息查询
