Invention Grant
- Patent Title: Printed circuit board having stiff and flexible characteristics
- Patent Title (中): 印刷电路板具有刚性和灵活的特性
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Application No.: US13151192Application Date: 2011-06-01
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Publication No.: US08536461B2Publication Date: 2013-09-17
- Inventor: Kuo-Hsiang Ouyang , Yao-Shun Tseng , Hone-Wei Tang
- Applicant: Kuo-Hsiang Ouyang , Yao-Shun Tseng , Hone-Wei Tang
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: TW99137726A 20101103
- Main IPC: H05K3/46
- IPC: H05K3/46
Abstract:
A printed circuit board comprising a hard portion of at least one main hard PCB, and at least one secondary hard PCB; and a flexible portion to connect the main hard PCB to the secondary hard PCB both physically and electrically and enabling the secondary hard PCB to move in relation to the main hard PCB.
Public/Granted literature
- US20120106115A1 PRINTED CIRCUIT BOARD HAVING STIFF AND FLEXIBLE CHARACTERISTICS Public/Granted day:2012-05-03
Information query
