Invention Grant
- Patent Title: Method of assembling shielded integrated circuit device
- Patent Title (中): 屏蔽集成电路器件组装方法
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Application No.: US13092162Application Date: 2011-04-22
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Publication No.: US08536684B2Publication Date: 2013-09-17
- Inventor: Wei Min Chen , Zhigang Bai , Zhijie Wang
- Applicant: Wei Min Chen , Zhigang Bai , Zhijie Wang
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor. Inc
- Current Assignee: Freescale Semiconductor. Inc
- Current Assignee Address: US TX Austin
- Agent Charles Bergere
- Priority: CN201010236800 20100721
- Main IPC: H01L23/29
- IPC: H01L23/29
Abstract:
A method of assembling an integrated circuit (IC) device includes the steps of providing a lead frame or substrate panel, attaching a semiconductor die to the lead frame or substrate panel and electrically coupling the die to the lead frame or substrate panel. The method further includes encapsulating the die with a first encapsulant, and the encapsulating the first encapsulant with a second encapsulant where the second encapsulant includes a material that provides electromagnetic shielding.
Public/Granted literature
- US20120018858A1 METHOD OF ASSEMBLING INTEGRATED CIRCUIT DEVICE Public/Granted day:2012-01-26
Information query
IPC分类:
