Invention Grant
- Patent Title: Housing with foot pads and couplers
- Patent Title (中): 带脚垫和耦合器的外壳
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Application No.: US13227612Application Date: 2011-09-08
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Publication No.: US08537546B2Publication Date: 2013-09-17
- Inventor: Cheng-Feng Shih
- Applicant: Cheng-Feng Shih
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Altis & Wispro Law Group, Inc.
- Priority: TW100214716U 20110809
- Main IPC: G06F1/16
- IPC: G06F1/16

Abstract:
A housing includes a cover, a plurality of foot pads and a plurality of couplers. Each of the plurality of foot pads is fixed on a corresponding one of the couplers and each of the couplers is pivotable about the cover. The cover defines a plurality of first receiving portions and a plurality of second receiving portions for receiving the plurality of couplers and the plurality of foot pads. Each of the plurality of foot pads and each of the plurality of couplers rotates relative to the cover to selectively receive the foot pad and the coupler in the first receiving portion and in the second receiving portion, so as to suspend the housing from a wall and to place the housing on a supporting surface.
Public/Granted literature
- US20130037546A1 HOUSING WITH FOOT PADS AND COUPLERS Public/Granted day:2013-02-14
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