Invention Grant
- Patent Title: Repair apparatus and method for circuit board assembly
- Patent Title (中): 电路板组装修理装置及方法
-
Application No.: US12982813Application Date: 2010-12-30
-
Publication No.: US08537547B2Publication Date: 2013-09-17
- Inventor: Yu-Ching Liu , Chi-An Yu , Xi-Hang Li , Bing Liu , Zhi-Bing Li , Jie-Peng Kang , Jing-Bin Liang , Hai-Gui Huang
- Applicant: Yu-Ching Liu , Chi-An Yu , Xi-Hang Li , Bing Liu , Zhi-Bing Li , Jie-Peng Kang , Jing-Bin Liang , Hai-Gui Huang
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Fu Tai Hua Industry (Shenzhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Fu Tai Hua Industry (Shenzhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201010219687 20100707
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A repair apparatus for a circuit board assembly includes a cooling device for a surface of the circuit board assembly opposite to the surface to be repaired. The cooling device defines a chamber for receiving the circuit board assembly. The circuit board assembly is disposed within the chamber to define a heat exchange space between the circuit board assembly and the bottom of the chamber. A method for repairing a circuit board assembly is also provided.
Public/Granted literature
- US20120008284A1 REPAIR APPARATUS AND METHOD FOR CIRCUIT BOARD ASSEMBLY Public/Granted day:2012-01-12
Information query
