A faceplate assembly includes a cover plate having a front wall and a rim surrounding a perimeter of the front wall. The rim has a rim opening therethrough. The front wall has a pair of mounting posts extending therefrom that are configured to be received in keyholes of a phone to support the phone. A subplate configured to be mounted to a wall outlet. The subplate has an end wall and a base with a base opening therethrough and the subplate is configured to hold a modular jack. The cover plate is coupled to the subplate such that the rim and base openings are aligned with one another and are configured to receive a patch cord therethrough.