Invention Grant
- Patent Title: MRI compatible implantable lead
- Patent Title (中): MRI兼容植入式铅
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Application No.: US12889189Application Date: 2010-09-23
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Publication No.: US08538553B2Publication Date: 2013-09-17
- Inventor: Yong D. Zhao , Rolf Hill , Ingmar Viohl , Martin Cholette
- Applicant: Yong D. Zhao , Rolf Hill , Ingmar Viohl , Martin Cholette
- Applicant Address: US CA Sylmar
- Assignee: Pacesetter, Inc.
- Current Assignee: Pacesetter, Inc.
- Current Assignee Address: US CA Sylmar
- Main IPC: A61N1/00
- IPC: A61N1/00

Abstract:
An implantable lead is provided that includes a lead body configured to be implanted in a patient. The lead body has a distal end and a proximal end, and a lumen extending between the distal and proximal ends and includes a connector assembly provided at the proximal end of the lead body. The connector assembly is configured to connect to an implantable medical device and includes an electrode provided proximate to the distal end of the lead body with the electrode configured to at least one of deliver stimulating pulses and sense electrical activity. A multi-layer coil is located within the lumen and extends at least partially along a length of the lead body. The coil includes a first winding formed with multiple winding turns, the winding turns being segmented in an alternating pattern of insulated segments and non-insulated segments along the length of the lead body. The multi-layer coil further includes a winding turn connective layer extending along and interconnecting the winding turns within at least one of the non-insulated segments. The multi-layer coil further includes a first winding formed with multiple winding turns, the winding turns being segmented into an alternating pattern of insulated segments and non-insulated segments along a length of the winding with a winding turn connective layer extending along and interconnecting the winding turns within at least one of the non-insulated segments.
Public/Granted literature
- US20110079423A1 MRI COMPATIBLE IMPLANTABLE LEAD Public/Granted day:2011-04-07
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