Invention Grant
- Patent Title: Slide valve apparatus for automatic application of surface pressure and surface pressure application method thereof
- Patent Title (中): 用于自动应用表面压力和表面压力应用方法的滑阀装置
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Application No.: US13496352Application Date: 2010-12-01
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Publication No.: US08539977B2Publication Date: 2013-09-24
- Inventor: Kenji Yamamoto , Mototsugu Osada , Atsushi Takata
- Applicant: Kenji Yamamoto , Mototsugu Osada , Atsushi Takata
- Applicant Address: JP Tokyo
- Assignee: Shinagawa Refractories Co., Ltd.
- Current Assignee: Shinagawa Refractories Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, LLP
- Priority: JP2009-294034 20091225
- International Application: PCT/JP2010/071462 WO 20101201
- International Announcement: WO2011/077912 WO 20110630
- Main IPC: B22D41/34
- IPC: B22D41/34

Abstract:
In order to simplify work of applying and releasing a surface pressure in a slide valve device constructed of a fixed plate, a slide plate, a seal plate, and the like, provided is a slide valve device for automatic surface pressure application and a surface pressure application method therefor, the slide valve device including: a base frame (2) including a positioning member (51) for determining an arrangement location (X) of a seal case (21) and a stopper (52) for fixing the seal case (21) at the arrangement location (X); and a slide case (4) including a pusher (53) for sliding the seal case (21) together with the slide case (4) when sliding the slide case (4) in a surface pressure application direction.
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