发明授权
US08541854B2 Method of minimizing beam bending of MEMS device by reducing the interfacial bonding strength between sacrificial layer and MEMS structure
失效
通过降低牺牲层和MEMS结构之间的界面结合强度来最小化MEMS器件的束弯曲的方法
- 专利标题: Method of minimizing beam bending of MEMS device by reducing the interfacial bonding strength between sacrificial layer and MEMS structure
- 专利标题(中): 通过降低牺牲层和MEMS结构之间的界面结合强度来最小化MEMS器件的束弯曲的方法
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申请号: US13349596申请日: 2012-01-13
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公开(公告)号: US08541854B2公开(公告)日: 2013-09-24
- 发明人: John M. Cotte , Nils D. Hoivik , Christopher Jahnes , Minhua Lu , Hongqing Zhang
- 申请人: John M. Cotte , Nils D. Hoivik , Christopher Jahnes , Minhua Lu , Hongqing Zhang
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: Novak Druce Connolly Bove + Quigg LLP
- 代理商 David P. Morris, Esq.
- 主分类号: H01L21/00
- IPC分类号: H01L21/00
摘要:
The beam bending of a MEMS device is minimized by reducing interfacial strength between a sacrificial layer and a MEMS structure.