Invention Grant
- Patent Title: Subscriber identity module (SIM) card
- Patent Title (中): 用户识别模块(SIM)卡
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Application No.: US13171421Application Date: 2011-06-28
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Publication No.: US08544755B2Publication Date: 2013-10-01
- Inventor: Rahamat Bidin , Hao Liu
- Applicant: Rahamat Bidin , Hao Liu
- Applicant Address: SG Singapore
- Assignee: United Test and Assembly Center Ltd.
- Current Assignee: United Test and Assembly Center Ltd.
- Current Assignee Address: SG Singapore
- Agency: Horizon IP Pte. Ltd.
- Main IPC: G06K19/06
- IPC: G06K19/06

Abstract:
A SIM card is presented. The SIM card includes a support carrier having a first and a second major surface. The support carrier includes a cavity which extends partially into the carrier from the first major surface. The SIM card further includes a chip package disposed within the cavity. The support carrier is sufficiently flexible to bend when the SIM card is being inserted into or removed from a SIM card holder.
Public/Granted literature
- US20110315779A1 SUBSCRIBER IDENTITY MODULE (SIM) CARD Public/Granted day:2011-12-29
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