A MEMS integrated circuit includes a silicon substrate having a frontside with a drive circuitry layer and a backside. A MEMS layer is disposed on the drive circuitry layer. The MEMS layer includes a plurality of MEMS devices electrically connected to the drive circuitry layer. Connector posts extends from the drive circuitry layer to a contact pad positioned in a roof of the MEMS layer and through-silicon connectors extending linearly from the contact pad, through the drive circuitry layer and the silicon substrate, towards the backside of the silicon substrate. Each through-silicon connector terminates at a backside integrated circuit contact, such that each integrated circuit contact is electrically connected to the drive circuitry layer via the contact pad positioned in the roof of the MEMS layer.