Invention Grant
- Patent Title: Substrate processing apparatus and substrate processing method
- Patent Title (中): 基板加工装置及基板处理方法
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Application No.: US13545685Application Date: 2012-07-10
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Publication No.: US08545668B2Publication Date: 2013-10-01
- Inventor: Takeshi Yoshida
- Applicant: Takeshi Yoshida
- Applicant Address: JP
- Assignee: Dainippon Screen Mfg. Co., Ltd.
- Current Assignee: Dainippon Screen Mfg. Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: JP2005-103201 20050331; JP2005-103202 20050331; JP2005-103203 20050331
- Main IPC: H01L21/304
- IPC: H01L21/304 ; B08B3/04
Abstract:
A substrate processing apparatus comprises a substrate holding mechanism, a process liquid supplying mechanism supplying a process liquid, a first guide portion around the substrate holding mechanism having an upper edge portion extending toward the rotation axis for guiding scattered process to flow down, a second guide portion provided around the substrate holding mechanism outside the first guide portion and having an upper edge portion extending toward the rotation axis as vertically overlapping with the upper edge portion of the first guide portion for further guiding the scattered process liquid to flow down, a recovery channel provided outside and integrally with the first guide portion for recovering the process liquid guided by the second guide portion, and a driving mechanism for moving up and down the first guide portion and the second guide portion independently of each other.
Public/Granted literature
- US20120298152A1 Substrate Processing Apparatus And Substrate Processing Method Public/Granted day:2012-11-29
Information query
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