Invention Grant
- Patent Title: Planar interconnect structure for hybrid circuits
- Patent Title (中): 混合电路的平面互连结构
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Application No.: US13435548Application Date: 2012-03-30
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Publication No.: US08546186B2Publication Date: 2013-10-01
- Inventor: Craig Dumas , Vijaykumar Sundermurthy
- Applicant: Craig Dumas , Vijaykumar Sundermurthy
- Applicant Address: US MN Eden Prairie
- Assignee: Starkey Laboratories, Inc.
- Current Assignee: Starkey Laboratories, Inc.
- Current Assignee Address: US MN Eden Prairie
- Agency: Schwegman, Lundberg & Woessner, P.A.
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
Described herein is an electronic device in which one or more planar interconnect structure are interposed between two substrates each incorporating a hybrid circuit. The planar interconnect structure has a plurality of conductive traces formed on one of its faces for electrically connecting sets of interconnection points of each of the hybrid circuits.
Public/Granted literature
- US20130005084A1 PLANAR INTERCONNECT STRUCTURE FOR HYBRID CIRCUITS Public/Granted day:2013-01-03
Information query
IPC分类:
