Invention Grant
- Patent Title: Electronic part and method of manufacturing the same
- Patent Title (中): 电子零件及其制造方法
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Application No.: US12857884Application Date: 2010-08-17
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Publication No.: US08546187B2Publication Date: 2013-10-01
- Inventor: Masateru Koide , Daisuke Mizutani
- Applicant: Masateru Koide , Daisuke Mizutani
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Squire Sanders (US) LLP
- Priority: JP2009-191271 20090820
- Main IPC: H01L21/768
- IPC: H01L21/768
Abstract:
A method of manufacturing a multi-chip module includes: securing a plurality of chips on a surface of a flat-shaped member through a solder bump; connecting the plurality of chips with each other by a bonding wire, at surfaces, opposite to the flat-shaped member side, of the plurality of chips; and electrically connecting the plurality of chips with a board, at the surfaces, opposite to the flat-shaped member side, of the plurality of chips.
Public/Granted literature
- US20110042806A1 MULTI-CHIP MODULE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2011-02-24
Information query
IPC分类:
