发明授权
US08546700B2 Capacitor for incorporation in wiring board, wiring board, method of manufacturing wiring board, and ceramic chip for embedment
有权
用于布线板的电容器,布线板,制造布线板的方法和用于嵌入的陶瓷芯片
- 专利标题: Capacitor for incorporation in wiring board, wiring board, method of manufacturing wiring board, and ceramic chip for embedment
- 专利标题(中): 用于布线板的电容器,布线板,制造布线板的方法和用于嵌入的陶瓷芯片
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申请号: US13042686申请日: 2011-03-08
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公开(公告)号: US08546700B2公开(公告)日: 2013-10-01
- 发明人: Hiroshi Yamamoto , Toshitake Seki , Shinji Yuri , Masaki Muramatsu , Motohiko Sato , Kazuhiro Hayashi , Jun Otsuka , Manabu Sato
- 申请人: Hiroshi Yamamoto , Toshitake Seki , Shinji Yuri , Masaki Muramatsu , Motohiko Sato , Kazuhiro Hayashi , Jun Otsuka , Manabu Sato
- 申请人地址: JP Aichi
- 专利权人: NGK Spark Plug Co., Ltd.
- 当前专利权人: NGK Spark Plug Co., Ltd.
- 当前专利权人地址: JP Aichi
- 代理机构: Sughrue Mion, PLLC
- 优先权: JP2005-228936 20050805; JP2005-228937 20050805; JP2005-267592 20050914; JP2006-145724 20060525; JP2006-145725 20060525
- 主分类号: H05K1/16
- IPC分类号: H05K1/16
摘要:
A capacitor comprising: a capacitor body including a plurality of laminated dielectric layers, a plurality of inner electrode layers which are respectively disposed between mutually adjacent ones of the dielectric layers, a first main surface located in a laminated direction of the dielectric layers, and a second main surface opposite to the first main surface; a first outer electrode formed on the first main surface of the capacitor body and electrically connected to the inner electrode layers; a second outer electrode formed on the second main surface of the capacitor body and electrically connected to the inner electrode layers; a first dummy electrode formed on the first main surface of the capacitor body; and a second dummy electrode formed on the second main surface of the capacitor body.
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