An embodiment of an apparatus is disclosed. This embodiment of the apparatus includes an interposer, a first die stack, a second die stack, a third die stack, and a fourth die stack which are all coupled to the interposer. The interposer provides a common base for and a stratum of each of the first die stack, the second die stack, the third die stack, and the fourth die stack. The first die stack includes an optical engine. The optical engine includes at least one optical engine die. The second die stack includes a plurality of programmable resource dies. The third die stack includes at least one memory die. The fourth die stack includes a serializer-deserializer die.