Invention Grant
- Patent Title: Memory module and memory system comprising memory module
- Patent Title (中): 内存模块和内存系统，包括内存模块
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Application No.: US12897189Application Date: 2010-10-04
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Publication No.: US08547761B2Publication Date: 2013-10-01
- Inventor: Seok-Il Kim , You-Keun Han , Jung-Joon Lee
- Applicant: Seok-Il Kim , You-Keun Han , Jung-Joon Lee
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Volentine & Whitt, PLLC
- Priority: KR10-2009-0133214 20091229
- Main IPC: G11C7/00
- IPC: G11C7/00
Abstract:
A memory module comprises a plurality of semiconductor memory devices each having a termination circuit for a command/address bus. The semiconductor memory devices are formed in a substrate of the memory module, and they operate in response to a command/address signal, a data signal, and a termination resistance control signal.
Public/Granted literature
- US20110161576A1 MEMORY MODULE AND MEMORY SYSTEM COMPRISING MEMORY MODULE Public/Granted day:2011-06-30
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