Disclosed herein is an adhesive application method of applying adhesive to a protruding part formed on a substrate. The adhesive application method includes an adhesive preparing step of forming an adhesive layer on the surface of a plate member, an adhesive applying step of allowing the protruding part and the adhesive layer to be brought into contact with each other such that the surface of the substrate around the protruding part does not contact the adhesive layer, and a moving step of moving the substrate and the plate member relative to each other in the plane parallel with the surface of the plate member while the surface of the substrate around the protruding part is not in contact with the adhesive layer and the protruding part and the adhesive layer are in contact with each other.